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172013-02
2010.7.15:\"Wood preservative composition and wood treatment method\" 一文介绍了
2010.7.15:"Wood preservative composition and wood treatment method" 一文介绍了一种木材防腐剂的生产和应用。该木材防腐剂成分包括一个水性防腐剂和 0.001-1.0 % 聚···
172013-02
2010.7.14:“Sealant material for plastic liquid crystal display cells including one component
2010.7.14:“Sealant material for plastic liquid crystal display cells including one component epoxy resin composition” 一文介绍了一种为密封塑料液晶显示单元的···
172013-02
2010.6.28:“Expandable epoxy resin-based systems modified with thermoplastic polymers
2010.6.28:“Expandable epoxy resin-based systems modified with thermoplastic polymers” 一文介绍了一种热塑性聚合物改性的弹性环氧树脂系统。该弹性热可固化组成包···
172013-02
2010.6.26:“Reducing dusting of epoxy laminates” 一文介绍了一种覆铜板用的浸渍料新配方
2010.6.26:“Reducing dusting of epoxy laminates” 一文介绍了一种覆铜板用的浸渍料新配方。据介绍使用这种浸渍料生产的覆铜板,在印刷电路板生产过程中能减少灰尘的形···
172013-02
2010.6.25:“Epoxy hardener systems based on aminobis(methylene-ethyleneurea)”一文介绍
2010.6.25:“Epoxy hardener systems based on aminobis(methylene-ethyleneurea)”一文介绍了一种新颖潜伏性环氧固化剂制备,该环氧树脂固化系统具有相对长的潜伏期和在···
172013-02
2010.6.21:“Epoxy Resin Molding Material for Sealing and Electronic Component Device
2010.6.21:“Epoxy Resin Molding Material for Sealing and Electronic Component Device” 一文介绍了新型环氧树脂塑封料的制作工艺,该环氧树脂塑封料包括环氧树脂(A···